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Moore's Law Now Requires Advanced Packaging - SemiEngineering
Moore's Law Now Requires Advanced Packaging SemiEngineering
L-R: Walter Ng, UMC; Calvin Cheung, ASE; Ajay Lalwani, eSilicon; Vic Kulkarni, ANSYS; Tien Shiah, Samsung. (Photo credit: Patricia MacLeod/ASE).
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