Unsticking Moore's Law - SemiEngineering

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Unsticking Moore's Law SemiEngineering

Unsticking Moore's Law Applied Materials' VP looks at what's next for semiconductor manufacturing and the impact of variation, new materials and different ...

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04.02.2019 (2298日前)

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semiconductor manufacturing, semiconductors, applied materials, variation, von neumann architecture, etch, deposition, cobalt, advanced packaging, moore’s law, heterogeneous integration, virtual reality, gpus, cpus, analog, in-memory computing, mram, memory, phase-chang

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